Honer
Contact Us
Mobile:15814406156
Tel:0755-23024958
Fax:0755-23024958
QQ:409387861
Email:info@kartain.com
Msn:china-pcb@hotmail.com
Skype:chinacircuit
Add:#3RD BUILDING HONGCHONG INDUSTRIAL DISTRICT HONGXING SONGGANG TOWN BAOAN,SHENZHEN,GUANGDONG,CHINA-518104

           

Name:FCBGA/FCCSP ABF package pcb boards
Place of OriginCHINA
Minimum Order1000pcs
MaterialBT,Mitsubishi,Hitachi,Panasonic or specified,ABF material
Mini.Line space/width1mil--25um
Finished thickness0.1-0.4mm
Min drilling vias0.05mm
Min PADS gap0.05mm
Copper weight8um--35um
ShippingDHL,TNT,FedEx,UPS,Air shipping,Sea shipping
Payment termsWestern union,Paypal, T/T
IC substrate packageUDP,CSP,SIP,FMC,LGI,PBGA,SSD,MEMS,MiniLED,SSOP,TSOP,QFP,TQFP
Email US:info@kartain.com

Product Description Contact Us

What is FCPGA/FCCSP PCB---IC substrate PCB CHINA

Flip Chip BGA (FCBGA) packages are assembled around state‑of‑the‑art, single unit laminate or ceramic substrates. Utilizing multiple high density routing layers, laser drilled blind, buried and stacked vias, and ultra fine line/space metallization, FCBGA substrates have the highest routing density available. By combining flip chip interconnect with ultra advanced substrate technology, FCBGA packages can be electrically tuned for maximum electrical performance. Once the electrical function is defined, the design flexibility enabled by flip chip also allows for significant options in final package design. Kartain offers FCBGA packaging in a variety of product formats to fit a wide range of end application requirements.

FCBGA / FCCSP pcb

FCBGA/FCCSP ABF package pcb boards Technology Solutions

 Substrates

4-18 layer laminate build-up substrates

High CTE ceramic

Coreless

Bump Types

Eutectic Sn/Pb

Pb-free (green)

Cu pillar (array and fine pitch peripheral)

Package Formats

Bare die

Lidded

 

FCBGA/FCCSP ABF package pcb boards production capacity

Process capability
Item Capability
Material Shengyi,BT,Mitsubishi,Toshiba,LG
Layers 1-8layer
Min Boards thk 2layer--0.1mm
4layer--0.18mm
6layer--0.26mm
Min Vias/blind vias 100um/55um
Min Line spacing/Width 25um/25um
Copper Weight 8-35um,70um
Surface finished ENIG,NiPdAu,Immersion Silver
Soldermask Black Taiyo soldermask,White,Red,Yellow,Blue soldermask
Special technics Tenting/Etech back/Buss-less/MSAP/Plugged
Application

Semiconductor Integrated Circuit,MEMS,Antenna,Medical equipment,RAM,SD

,SSD,Camera,Fingerprint Recognition,IC substrate package

Min drilling vias 0.05mm
Min pad gap 0.05mm
IC substrate package UDP,CSP,SIP,FMC,LGI,PBGA,SSD,MEMS,MiniLED,SSOP,TSOP,QFP,TQFP

The special testing for FCBGA/FCCSP ABF package pcb boards

FCBGA / FCCSP pcb test device

             1116 X-Y C HiTESTERis a non-fixture testing


And we can supply the FCBGA/FCCSP ABF package pcb boards with ABF material,

the 4layer pcb thickness reach to 0.2mm.


CONTACT KARTAIN TECHNOLOGY

Kartain is committed to to provide you with exceptional support and satisfaction for your PCB fabrication and PCB assembly needs from QTA prototyping to High volume production.

Our experts are available to consult you for your project. So, call us anytime at 0755-23024958 or  get in touch via email.



More Contact Info:

KARTAIN Factory: #3RD BUILDING HONGCHONG INDUSTRIAL DISTRICT HONGXING SONGGANG TOWN BAOAN,SHENZHEN,GUANGDONG,CHINA-518104

Office:#212 Shuiyuanju Building,Bao'an East ,Shajing Town,Bao'an District,Shenzhen,China.

Tel: +0086(755)2302 4958, 015814406156   wechat: 409387861

Fax:+0086(755)2302 4958

Email: info@kartain.com

Skype: chinacircuit

Whatsapp: +86015814406156

Website: www.kartain.com     www.kartainpcb.com    www.kartainfpc.com

Facebook:https://www.facebook.com/chinapcbmanufacturer/

LinkedIn: https://www.linkedin.com/in/kartainpcb/

pcb wechat

Hits: 【Print】