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Metel PCB capacity
Metal Base Circuit Board Capability
Type Item Processing Capacity
Material Brand of MCCL Bergquist,Laird,SANYO,Polytronics,TOTKING,Arlon,Doosan,Shengyi,Eastpower,DENKA,CSEM,SEKISUI,Dupont,Taconic,AISMALIBAR,Ventec,Panasonic
Laminate type Al,Cu,ceramic
Metal Type Al: 1060,1100,5052,6061                                                 
Cu:C1100,C1220
Ceramic:96% Al2O3,AlN
Laminate Size 500x600mm,500x1200mm
Max.Production length 1800mm
Board Thickness 0.2-3.2mm
Standard Metel Thickness 0.2mm,0.3mm,0.4mm,0.5mm,0.6mm,0.8mm,1.0mm,1.2mm,1.5mm,2.0mm,2.5mm,3.0mm
Tolerance of board thickness ±0.1mm
Dieletric thickness 50um,75um,100um,120um,150um,200um
Thermal Conductivity 1.0W/m·K-8.0W/m·K
Breakdown Volatge 6KV AC
Layers 1-4layers
Trace Min.Trace width/Spacing 4mil
Tolerance of trace width/spacing 15%
Copper thickness Copper thickness 1/3-4OZ
Hole Size Drilling  hole size Dia.0.5mm-6.0mm
Finished Hole Size Dia.0.5mm-6.0mm
Hole tolerance ±0.075mm
Tolerance of hole position ±0.1mm
Min.Countsink Size 1.0mm
Min.Depth of Countsink 0.15mm
Aspect Radio 5:2
Soldermask Min.Solder Bridge 0.1mm
Min.Soldermask opening 0.05mm
Min.resistance welding spacer ring 0.1mm
Min.soldermask override conductor 0.05mm
Silkscreen Min.Silkscreen trace 0.11mm
Min.silkscreen height 0.7mm
Min.distance from silkscreen to pad 0.15mm
Dimension Tolerance of outline dimension ±0.10mm
Surface Finish Surface Finish HASL,OSP,ENIG,Immersion Silver,Immersion Tin,ENEPIG
Especially Technics Especially Technics Insulating Hole,Anodic Oxidation,Aluminum LOGO,Screw Hole,Zero sapce,COB,DAM(AL,Silica gel,Silkmask),Bulge Base
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