Email US:info@kartain.com
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Product Description Contact Us
BGA package PCB description
Kartain Technology CO., LTD was a new IC substrate PCB factory in CHINA. Which was founded in December 2019,
factory was located in shenzhen city China,20KM nearby Shenzhen airport. Factory area of Kartain is more than
4000 square meters, which invested 5 million USD to start, has more than 100 employees, more than 30% technical
engineers,And machines was imported from Japan, the monthly production capacity is more than 100KKpcs,Equipped
with professional equipment for IC substrate PCB. Kartain's main products are: LGA substrate PCB,CSP substrate PCB,
SIP substrate PCB,PBGA substrate PCB,MINILED substrate PCB,UDP substrate PCB, etc.
IC substrate PCB Production Capacity
Process | parameter | Cpacity | tolerance |
Thickness | 2layer | 0.08 | ±0.02 |
4layer | 0.2 | ±0.03 | |
6layer | 0.35 | ±0.04 | |
Drilling | Laser Thru drilling | 0.075 | ±0.025 |
Laser blind drilling | 0.075 | ±0.025 | |
mechanical thru holes | 0.1 | ±0.025 | |
Capacity | PAD size | 0.1mm | ±0.015 |
PAD spacing | 0.05mm | ±0.015 | |
Line Width | 0.04mm | ±0.01 | |
Line Spacing | 0.04mm | ±0.01 | |
Min.via diameter | 0.075mm | ±0.025 | |
Soldrmask opening | 0.1mm | ±0.05 | |
PAD shift | 0.05mm | ±0.05 | |
Hole shift | 0.05mm | ±0.05 | |
PSR shift | 0.05mm | ±0.05 |
Standard Material list for IC substrate PCB
MITSUBISH Non-haloganated Low CTE BT Resin Laminate for IC Plastic Packages
Grade | CCL Thickness | BT Prepregs | Prepreg Thickness | property | Typical applications |
HL832NX type A | 0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6, 0.7, 0.8 | GHPL-830NX type A Series |
0.02 ~ 0.1 | low CTE, low shrinkage, and high Tg | CSP, BGA, Flip Chip Package, Coreless, SiP, Module, etc. |
CCL-832NSR type LC Series |
0.03,0.04,0.05,0.06,0.1,0.15,0.2,0.25,0.3,0.4 | GHPL-830NSR typeLC Series |
0.02 ~ 0.045 | Low CTE and low shrinkage | Coreless, SiP, Module, CSP, BGA, Flip Chip Package, etc. |
CCL-HL832NSR Series |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 | GHPL-830NSR Series |
0.02 ~ 0.08 | Low CTE and low shrinkage | Coreless, SiP, Module, CSP, BGA, Flip Chip Package, etc. |
CCL-832NSF type LC Series |
0.03, 0.04, 0.05, 0.06, 0.08, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 | GHPL-830NSF type LC Series |
0.015 ~ 0.1 | Ultra low CTE and low shrinkage | Flip Chip Package,Flip Chip Package, Coreless, CSP, BGA, SiP, Module, etc. |
CCL-HL832NSF Series |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.4 | GHPL-830NSF Series |
0.015 ~ 0.1 | Ultra low CTE and low shrinkage | Flip Chip Package,Flip Chip Package, Coreless, CSP, BGA, SiP, Module, etc. |
CCL-HL832NSA type LC Series |
0.04 ~ 0.4 | GHPL-830NSA type LC Series |
0.025 ~ 0.08 | low CTE, low shrinkage, and high Tg,reduce the warpage of substrate for IC package. | Flip Chip Package, CSP, BGA, etc. |
CCL-HL972LF type LD Series |
0.04 ~ 0.8 | GHPL-970LF type LD Series |
0.02 ~ 0.1 | Low Transmission Loss, Low CTE, Non-halogenated | SiP, Module, CSP, BGA, Flip Chip Package, Coreless, etc |
CCL-HL972LFG type LD Series |
0.04 ~ 0.5 | GHPL-970LFG type LD Series |
0.025 ~ 0.1 | Low Transmission Loss, Low CTE, Non-halogenated | SiP, Module, CSP, BGA, Flip Chip Package, Coreless, etc |
CCL-HL972LFG Series |
0.04 ~ 0.5 | GHPL-970LFG Series |
0.025 ~ 0.1 | Low Transmission Loss, Low CTE, Non-halogenated | SiP, Module, CSP, BGA, Flip Chip Package, Coreless, etc |
CCL-HL820WDI | 0.05, 0.06, 0.1-1.0(0.1step), 0.46 |
high reflectance of visible light | Chip-LED |
DOOSAN Halogen Free & Phosphorous Material
CCL Product Number | Property | Classification | Typical applications |
DS-7409 HGB (G) DS-7409 HGB (GE) |
Normal CTE | Normal Modulus & Normal Tg | |
DS-7409 HGB (LE) DS-7409 HGB (KL) DS-7409 HGB (JE) |
Low CTE | Middle modulus & Middle Tg | |
DS-7409 HGB (X) DS-7409 HGB (J) DS-7409 HGB (I) DS-7409 HG (ZL) |
Ultra low CTE | High modulus & High Tg | PBGA,BoC,CSP,FCBGA,FCCSP,etc |
DS-7409 HG (ZQ) | Low modulus & High Tg | ||
DS-7409 HG (FQ) | Low modulus & Low Tg | ||
DS-7409 HDB | Low Dk, Df | Low Dk | |
DS-7409 HGB (KL) | Low CTE & Low Dk | ||
DS-7409 HG (KQ) | Low Df | ||
DS-7402 DS-7402M DS-7402LC DS-8502LC |
Halogen free | Middle Tg Low Dk High Tg, Low CTE Low Dk/Df |
Standard Stack Up for IC substrate PCB
standard 4layer thickness 0.22mm | |||||
AU | 0.03-0.05um | ||||
Ni | 3-8um | ||||
CU | CU7um+plated 8um | 15 | |||
BTPP | 50um | 50 | |||
CU | CU7um+plated 8um | 15 | |||
BT | 50um | 50 | |||
CU | CU7um+plated 8um | 15 | |||
BTPP | 50um | 50 | |||
CU | CU7um+plated 8um | 15 | |||
Ni | 3-8um | ||||
AU | 0.03-0.05um | ||||
Final thickness | 220um±30um |
standard 6layer thickness 0.35mm
AU | 0.03-0.05um | ||||
Ni | 3-8um | ||||
CU | CU7um+plated 8um | 15 | |||
BTPP | 50um | 50 | |||
CU | CU7um+plated 8um | 15 | |||
BTPP | 50um | 50 | |||
CU | CU7um+plated 8um | 15 | |||
BT | 50um | 50 | |||
CU | CU7um+plated 8um | 15 | |||
BTPP | 50um | 50 | |||
CU | CU7um+plated 8um | 15 | |||
BTPP | 50um | 50 | |||
CU | CU7um+plated 8um | 15 | |||
Ni | 3-8um | ||||
AU | 0.03-0.05um | ||||
Final thickness | 350um±30um |
AU | 3-8um | ||||
Ni | 0.075-0.1um | ||||
Plating CU | 10um | 13 | |||
CU | 12um | 12 | |||
Core BT | 250um | 250 | |||
CU | 12um | 12 | |||
Plating CU | 10um | 13 | |||
Ni | 3-8um | ||||
AU | 0.075-0.1um | ||||
Final thickness | 300um±30um |
The Production Equipment for IC substrate PCB
The standard shipping express way
CONTACT KARTAIN TECHNOLOGY
Kartain is committed to to provide you with exceptional support and satisfaction for your PCB fabrication and PCB assembly needs from QTA prototyping to High volume production.
Our experts are available to consult you for your project. So, call us anytime at 0755-23024958 or get in touch via email.
More Contact Info:
KARTAIN Factory: #3RD BUILDING HONGCHONG INDUSTRIAL DISTRICT HONGXING SONGGANG TOWN BAOAN,SHENZHEN,GUANGDONG,CHINA-518104
Office:#212 Shuiyuanju Building,Bao'an East ,Shajing Town,Bao'an District,Shenzhen,China.
Tel: +0086(755)2302 4958, 015814406156 wechat: 409387861
Fax:+0086(755)2302 4958
Email: info@kartain.com
Skype: chinacircuit
Whatsapp: +86015814406156
Website: www.kartain.com www.kartainpcb.com www.kartainfpc.com
Facebook:https://www.facebook.com/chinapcbmanufacturer/
LinkedIn: https://www.linkedin.com/in/kartainpcb/
CopyRight 2015-2020 Kartain Technology CO.,LTD
Office Addrsss:#3RD BUILDING HONGCHONG INDUSTRIAL DISTRICT HONGXING SONGGANG TOWN BAOAN,SHENZHEN,GUANGDONG,CHINA-518104
Zip code:518104
Tel:15814406156
Website: www.kartain.com,www.kartain-tech.com
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