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Location：Home--->Product Center >> IC Substrate PCB >> smart card payment card substrate pcb boards
Name:smart card payment card substrate pcb boards
MaterialFR4, BT, Flex all ok for smart card pcb
Thickness0.15mm normally
Copper18um
Soldermaskblack or coverlay
Surface finishedheavy gold, plating gold 5U
ApplicationPayment card, bank card, Fingerprint, NFC
Email US:info@kartain.com

Product Description Contact Us

Kartain technology CO.,LTD has been investing in the field of IC substrate since 2009, mainly producing 2-8 layers of UDP IC Substrate, LGA IC Substrate, CSP IC Substrate, PBGA IC Substrate and other IC Substrate samples and mass production, for various semiconductor research and development enterprises to provide stable products, fast delivery, the best service.


We have made lots of Payment card, bank card, membership card, Fingerprint, NFC,BLE,fingerprint card substrate PCB, application in bank,hospital,school and more.

The IC Substrate Material:

Core

MGC

HL832NXA

40 ，50 ，60 ，

100 ，150 ，200…

HL832NS,NS(LC),NSF

Doosan

DS-7409HGB(S)

DS-7409HGB(LE)

Hitachi

MCL-E-679FGB(S)

MCL-E-700G(R)

Panasonic

R1515H,R1515E

Prepreg

MGC

GHPL830NX-A

25 ，30 ，40 ，50 ，60…

GHPL830NS,NS(LC),NSF

Hitachi

GEA-679FG(S)

Panasonic

R1410E

Solder Mask

Taiyo

Green:AUS308,AUS320

15+/-7@Cu<=15μm

20+/-10

Black:EG23

Film Type:AUS410,SR1

25+/-10

Plugging Material

SAN-EI KAGAKU

PHP 900 Series

IC Substrate Production Capacity

Item

Specifications

Material

Shengyi,BT,Mitsubishi,Doushan,Toshiba,LG,Ajinomoto Buildup Film(ABF)

MASS Production

Samples Production

Layer

2-6layer

2-10layer

Min Drilling

100um

100um

Bonding Finger

Min.Pitch

105um

95um

Min.Width

35um

35um

Circuit Line

Min.Pitch

95um

25um

Min.Width

25um

25um

Min.Spacing

25um

25um

Min.Weding ring

80um

80um

Min.Thickness

2L

100um

100um

4L

300um

200um

6L

400um

300um

Line to PAD/EDGE

100um

100um

Soldermask

Solder PAD

50um

50um

Solder DAM

80um

70um

Thickness

20+/-5um

20+/-5um

Flatness

5um

5um

Surface Finish

Hard Gold

Ni: 5-15 µm,Au: 0.2-0.5 µm

Ni: 5-15 µm,Au: 0.2-2 µm

Soft Gold

Ni: 5-15 µm,Au: 0.3-0.8 µm

Ni: 5-15 µm,Au: 0.3-2 µm

ENEPIG-WB

Ni: 3-8 µm,Pd: 0.1-0.2 µm,

Au: 0.1-0.2 µm

Ni: 3-8 µm,Pd: 0.1-0.2 µm,

Au: 0.1-2µm

ENEPIG-SMT

Ni: 3-8 µm,Pd: 0.05-0.15 µm,

Au: 0.05-0.15 µm

Ni: 3-8 µm,Pd: 0.05-0.15 µm,

Au: 0.05-2 µm

OSP

OSP: 0.1-0.3 µm

OSP: 0.1-0.3 µm

CONTACT KARTAIN TECHNOLOGY

Kartain is committed to to provide you with exceptional support and satisfaction for your PCB fabrication and PCB assembly needs from QTA prototyping to High volume production.

Our experts are available to consult you for your project. So, call us anytime at 0755-23024958 or  get in touch via email.



More Contact Info:

KARTAIN Factory: #3RD BUILDING HONGCHONG INDUSTRIAL DISTRICT HONGXING SONGGANG TOWN BAOAN,SHENZHEN,GUANGDONG,CHINA-518104

Office:#212 Shuiyuanju Building,Bao'an East ,Shajing Town,Bao'an District,Shenzhen,China.

Tel: +0086(755)2302 4958, 015814406156   wechat: 409387861

Fax:+0086(755)2302 4958

Email: info@kartain.com

Skype: chinacircuit

Whatsapp: +86015814406156

Website: www.kartain.com     www.kartainpcb.com    www.kartainfpc.com

Facebook:https://www.facebook.com/chinapcbmanufacturer/

LinkedIn: https://www.linkedin.com/in/kartainpcb/

pcb wechat

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