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Location：Home--->Product Center >> SSD packing PCB >> SD Memory storage substrate PCB
Name:SD Memory storage substrate PCB
MaterialMitsubishi HL832NX
Thickness0.15mm
Layers2layer
Copper thickness25um
Surface finishedNiPdAu
Line width/sapcing3um/3um 1.5mil/1.5mil
Min.Vias0.075mm
ViasPlugged and vias plated
ApplicationSSD card memory
Email US:info@kartain.com

Product Description Contact Us

SD Memory storage substrate PCB description

 

Kartain Technology CO., LTD was a new IC substrate PCB factory in CHINA. Which was founded in December 2019, 

factory was located in shenzhen city China,20KM nearby Shenzhen airport. Factory area of Kartain is more than 

4000 square meters, which invested 5 million USD to start, has more than 100 employees, more than 30% technical 

engineers,And machines was imported from Japan, the monthly production capacity is more than 100KKpcs,Equipped 

with professional equipment for IC substrate PCB. Kartain's main products are: LGA substrate PCB,CSP substrate PCB,

SIP substrate PCB,PBGA substrate PCB,MINILED substrate PCB,UDP substrate PCB, etc. 


IC substrate PCB Production Capacity 

Process parameter Cpacity tolerance
Thickness 2layer 0.08 ±0.02
4layer 0.2 ±0.03
6layer 0.35 ±0.04
Drilling Laser Thru drilling 0.075 ±0.025
Laser blind drilling 0.075 ±0.025
mechanical thru holes 0.1 ±0.025
Capacity PAD  size 0.1mm ±0.015
PAD spacing 0.05mm ±0.015
Line Width 0.04mm ±0.01
Line Spacing 0.04mm ±0.01
Min.via diameter 0.075mm ±0.025
Soldrmask opening 0.1mm ±0.05
PAD shift 0.05mm ±0.05
Hole shift 0.05mm ±0.05
PSR shift 0.05mm ±0.05

 

Standard Material list for IC substrate PCB

MITSUBISH Non-haloganated Low CTE BT Resin Laminate for IC Plastic Packages

Grade CCL Thickness BT Prepregs Prepreg Thickness property Typical applications
HL832NX  type A 0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6, 0.7, 0.8 GHPL-830NX
type A Series		 0.02 ～ 0.1  low CTE, low shrinkage, and high Tg CSP, BGA, Flip Chip Package, Coreless, SiP, Module, etc.
CCL-832NSR
type LC Series		 0.03,0.04,0.05,0.06,0.1,0.15,0.2,0.25,0.3,0.4 GHPL-830NSR
typeLC Series		 0.02 ～ 0.045 Low CTE and low shrinkage Coreless, SiP, Module, CSP, BGA, Flip Chip Package, etc.
CCL-HL832NSR
Series		 0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 GHPL-830NSR
Series		 0.02 ～ 0.08 Low CTE and low shrinkage Coreless, SiP, Module, CSP, BGA, Flip Chip Package, etc.
CCL-832NSF
type LC Series		 0.03, 0.04, 0.05, 0.06, 0.08, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 GHPL-830NSF
type LC Series		 0.015 ～ 0.1 Ultra low CTE and low shrinkage Flip Chip Package,Flip Chip Package, Coreless, CSP, BGA, SiP, Module, etc.
CCL-HL832NSF
Series		 0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.4 GHPL-830NSF
Series		 0.015 ～ 0.1 Ultra low CTE and low shrinkage Flip Chip Package,Flip Chip Package, Coreless, CSP, BGA, SiP, Module, etc.
CCL-HL832NSA
type LC Series		 0.04 ～ 0.4 GHPL-830NSA
type LC Series		 0.025 ～ 0.08  low CTE, low shrinkage, and high Tg,reduce the warpage of substrate for IC package. Flip Chip Package, CSP, BGA, etc.
CCL-HL972LF
type LD Series		 0.04 ～ 0.8 GHPL-970LF
type LD Series		 0.02 ～ 0.1 Low Transmission Loss, Low CTE, Non-halogenated SiP, Module, CSP, BGA, Flip Chip Package, Coreless, etc
CCL-HL972LFG
type LD Series		 0.04 ～ 0.5 GHPL-970LFG
type LD Series		 0.025 ～ 0.1 Low Transmission Loss, Low CTE, Non-halogenated SiP, Module, CSP, BGA, Flip Chip Package, Coreless, etc
CCL-HL972LFG
Series		 0.04 ～ 0.5 GHPL-970LFG
Series		 0.025 ～ 0.1 Low Transmission Loss, Low CTE, Non-halogenated SiP, Module, CSP, BGA, Flip Chip Package, Coreless, etc
CCL-HL820WDI  0.05, 0.06,
0.1-1.0(0.1step), 0.46		 high reflectance of visible light Chip-LED

 

 

DOOSAN Halogen Free & Phosphorous Material

CCL Product Number Property Classification Typical applications
DS-7409 HGB (G)
DS-7409 HGB (GE)		 Normal CTE Normal Modulus & Normal Tg
DS-7409 HGB (LE)
DS-7409 HGB (KL)
DS-7409 HGB (JE)		 Low CTE Middle modulus & Middle Tg
DS-7409 HGB (X)
DS-7409 HGB (J)
DS-7409 HGB (I)
DS-7409 HG (ZL)		 Ultra low CTE  High modulus & High Tg PBGA,BoC,CSP,FCBGA,FCCSP,etc
DS-7409 HG (ZQ) Low modulus & High Tg
DS-7409 HG (FQ) Low modulus & Low Tg
DS-7409 HDB Low Dk, Df Low Dk
DS-7409 HGB (KL) Low CTE & Low Dk
DS-7409 HG (KQ) Low Df
DS-7402
DS-7402M
DS-7402LC
DS-8502LC		 Halogen free Middle Tg                                                   Low Dk
High Tg, Low CTE
Low Dk/Df

 

Standard Stack Up for IC substrate PCB

standard 4layer thickness 0.22mm
AU 0.03-0.05um
Ni 3-8um
CU CU7um+plated 8um 15
BTPP 50um 50
CU CU7um+plated 8um 15
BT 50um 50
CU CU7um+plated 8um 15
BTPP 50um 50
CU CU7um+plated 8um 15
Ni 3-8um
AU 0.03-0.05um
Final thickness 220um±30um

 

standard 6layer thickness 0.35mm

AU 0.03-0.05um
Ni 3-8um
CU CU7um+plated 8um 15
BTPP 50um 50
CU CU7um+plated 8um 15
BTPP 50um 50
CU CU7um+plated 8um 15
BT 50um 50
CU CU7um+plated 8um 15
BTPP 50um 50
CU CU7um+plated 8um 15
BTPP 50um 50
CU CU7um+plated 8um 15
Ni 3-8um
AU 0.03-0.05um
Final thickness 350um±30um

 

AU 3-8um
Ni 0.075-0.1um
Plating CU 10um 13
CU 12um 12
Core BT 250um 250
CU 12um 12
Plating CU 10um 13
Ni 3-8um
AU 0.075-0.1um
Final thickness 300um±30um

The Production Equipment for IC substrate PCB

the production equipment for IC substrate PCB

the production equipment for IC substrate PCB

the production equipment for IC substrate PCB


The standard shipping express way

the express way


CONTACT KARTAIN TECHNOLOGY

Kartain is committed to to provide you with exceptional support and satisfaction for your PCB fabrication and PCB assembly needs from QTA prototyping to High volume production.

Our experts are available to consult you for your project. So, call us anytime at 0755-23024958 or  get in touch via email.



More Contact Info:

KARTAIN Factory: #3RD BUILDING HONGCHONG INDUSTRIAL DISTRICT HONGXING SONGGANG TOWN BAOAN,SHENZHEN,GUANGDONG,CHINA-518104

Office:#212 Shuiyuanju Building,Bao'an East ,Shajing Town,Bao'an District,Shenzhen,China.

Tel: +0086(755)2302 4958, 015814406156   wechat: 409387861

Fax:+0086(755)2302 4958

Email: info@kartain.com

Skype: chinacircuit

Whatsapp: +86015814406156

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