UDP IC substrate PCB-Product Center-Kartain Technology CO.,LTD--0755-23024958,info@kartain.com-

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Name:	UDP IC substrate PCB
Material	Mitsubishi HL832NX
Thickness	0.18mm
Layers	2layer
Copper thickness	18um
Surface finished	NiPdAu
Line width/sapcing	3um/3um 1.5mil/1.5mil
Min.Vias	0.075mm
Vias	Plugged and vias plated
Application	UDP SSD card for memory storage
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Email US:info@kartain.com

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SSD card package PCB description

Kartain Technology CO., LTD was a new IC substrate PCB factory in CHINA. Which was founded in December 2019,

factory was located in shenzhen city China,20KM nearby Shenzhen airport. Factory area of Kartain is more than

4000 square meters, which invested 5 million USD to start, has more than 100 employees, more than 30% technical

engineers,And machines was imported from Japan, the monthly production capacity is more than 100KKpcs,Equipped

with professional equipment for IC substrate PCB. Kartain's main products are: LGA substrate PCB,CSP substrate PCB,

SIP substrate PCB,PBGA substrate PCB,MINILED substrate PCB,UDP substrate PCB, etc.

IC substrate PCB Production Capacity

Process	parameter	Cpacity	tolerance
Thickness	2layer	0.08	±0.02
	4layer	0.2	±0.03
	6layer	0.35	±0.04
Drilling	Laser Thru drilling	0.075	±0.025
	Laser blind drilling	0.075	±0.025
	mechanical thru holes	0.1	±0.025
Capacity	PAD size	0.1mm	±0.015
	PAD spacing	0.05mm	±0.015
	Line Width	0.04mm	±0.01
	Line Spacing	0.04mm	±0.01
	Min.via diameter	0.075mm	±0.025
	Soldrmask opening	0.1mm	±0.05
	PAD shift	0.05mm	±0.05
	Hole shift	0.05mm	±0.05
	PSR shift	0.05mm	±0.05

Standard Material list for IC substrate PCB

MITSUBISH Non-haloganated Low CTE BT Resin Laminate for IC Plastic Packages

Grade	CCL Thickness	BT Prepregs	Prepreg Thickness	property	Typical applications
HL832NX type A	0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6, 0.7, 0.8	GHPL-830NX type A Series	0.02 ～ 0.1	low CTE, low shrinkage, and high Tg	CSP, BGA, Flip Chip Package, Coreless, SiP, Module, etc.
CCL-832NSR type LC Series	0.03,0.04,0.05,0.06,0.1,0.15,0.2,0.25,0.3,0.4	GHPL-830NSR typeLC Series	0.02 ～ 0.045	Low CTE and low shrinkage	Coreless, SiP, Module, CSP, BGA, Flip Chip Package, etc.
CCL-HL832NSR Series	0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4	GHPL-830NSR Series	0.02 ～ 0.08	Low CTE and low shrinkage	Coreless, SiP, Module, CSP, BGA, Flip Chip Package, etc.
CCL-832NSF type LC Series	0.03, 0.04, 0.05, 0.06, 0.08, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4	GHPL-830NSF type LC Series	0.015 ～ 0.1	Ultra low CTE and low shrinkage	Flip Chip Package,Flip Chip Package, Coreless, CSP, BGA, SiP, Module, etc.
CCL-HL832NSF Series	0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.4	GHPL-830NSF Series	0.015 ～ 0.1	Ultra low CTE and low shrinkage	Flip Chip Package,Flip Chip Package, Coreless, CSP, BGA, SiP, Module, etc.
CCL-HL832NSA type LC Series	0.04 ～ 0.4	GHPL-830NSA type LC Series	0.025 ～ 0.08	low CTE, low shrinkage, and high Tg,reduce the warpage of substrate for IC package.	Flip Chip Package, CSP, BGA, etc.
CCL-HL972LF type LD Series	0.04 ～ 0.8	GHPL-970LF type LD Series	0.02 ～ 0.1	Low Transmission Loss, Low CTE, Non-halogenated	SiP, Module, CSP, BGA, Flip Chip Package, Coreless, etc
CCL-HL972LFG type LD Series	0.04 ～ 0.5	GHPL-970LFG type LD Series	0.025 ～ 0.1	Low Transmission Loss, Low CTE, Non-halogenated	SiP, Module, CSP, BGA, Flip Chip Package, Coreless, etc
CCL-HL972LFG Series	0.04 ～ 0.5	GHPL-970LFG Series	0.025 ～ 0.1	Low Transmission Loss, Low CTE, Non-halogenated	SiP, Module, CSP, BGA, Flip Chip Package, Coreless, etc
CCL-HL820WDI	0.05, 0.06, 0.1-1.0(0.1step), 0.46			high reflectance of visible light	Chip-LED

DOOSAN Halogen Free & Phosphorous Material

CCL Product Number	Property	Classification	Typical applications
DS-7409 HGB (G) DS-7409 HGB (GE)	Normal CTE	Normal Modulus & Normal Tg
DS-7409 HGB (LE) DS-7409 HGB (KL) DS-7409 HGB (JE)	Low CTE	Middle modulus & Middle Tg
DS-7409 HGB (X) DS-7409 HGB (J) DS-7409 HGB (I) DS-7409 HG (ZL)	Ultra low CTE	High modulus & High Tg	PBGA,BoC,CSP,FCBGA,FCCSP,etc
DS-7409 HG (ZQ)		Low modulus & High Tg
DS-7409 HG (FQ)		Low modulus & Low Tg
DS-7409 HDB	Low Dk, Df	Low Dk
DS-7409 HGB (KL)		Low CTE & Low Dk
DS-7409 HG (KQ)		Low Df
DS-7402 DS-7402M DS-7402LC DS-8502LC	Halogen free	Middle Tg Low Dk High Tg, Low CTE Low Dk/Df

Standard Stack Up for IC substrate PCB

standard 4layer thickness 0.22mm
AU		0.03-0.05um
Ni		3-8um
CU	CU7um+plated 8um	15
BTPP	50um	50
CU	CU7um+plated 8um	15
BT	50um	50
CU	CU7um+plated 8um	15
BTPP	50um	50
CU	CU7um+plated 8um	15
Ni		3-8um
AU		0.03-0.05um
Final thickness		220um±30um

standard 6layer thickness 0.35mm

AU		0.03-0.05um
Ni		3-8um
CU	CU7um+plated 8um	15
BTPP	50um	50
CU	CU7um+plated 8um	15
BTPP	50um	50
CU	CU7um+plated 8um	15
BT	50um	50
CU	CU7um+plated 8um	15
BTPP	50um	50
CU	CU7um+plated 8um	15
BTPP	50um	50
CU	CU7um+plated 8um	15
Ni		3-8um
AU		0.03-0.05um
Final thickness		350um±30um

AU		3-8um
Ni		0.075-0.1um
Plating CU	10um	13
CU	12um	12
Core BT	250um	250
CU	12um	12
Plating CU	10um	13
Ni		3-8um
AU		0.075-0.1um
Final thickness		300um±30um

The Production Equipment for IC substrate PCB

The standard shipping express way

CONTACT KARTAIN TECHNOLOGY

Kartain is committed to to provide you with exceptional support and satisfaction for your PCB fabrication and PCB assembly needs from QTA prototyping to High volume production.

Our experts are available to consult you for your project. So, call us anytime at 0755-23024958 or get in touch via email.

More Contact Info:

KARTAIN Factory: #3RD BUILDING HONGCHONG INDUSTRIAL DISTRICT HONGXING SONGGANG TOWN BAOAN,SHENZHEN,GUANGDONG,CHINA-518104

Office:#212 Shuiyuanju Building,Bao'an East ,Shajing Town,Bao'an District,Shenzhen,China.

Tel: +0086(755)2302 4958, 015814406156 wechat: 409387861

Fax:+0086(755)2302 4958

Email: info@kartain.com

Skype: chinacircuit

Whatsapp: +86015814406156

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Zip code：518104

Tel：15814406156

Website: www.kartain.com,www.kartain-tech.com

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